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(111)-Oriented Diamond Wire Drawing Dies
CVD & HPHT Dual-Technology Solutions for Precision Wire Manufacturing
Core Technical Parameters
Parameter | CVD Diamond | HPHT Diamond |
Process | Chemical Vapor Deposition | High Pressure High Temperature |
Orientation | (111) | (111) |
Wire Diameter | φ0.003mm~φ5.0mm | φ0.003mm~φ2.0mm |
Competitive Advantages
CVD Diamond Highlights
l Ultimate Precision
l Thermal Mastery
HPHT Diamond Strengths
l Cost Efficiency
l Complex Profiles
Shared Benefits
l Monocrystalline structure eliminates grain-boundary failures
l (111) plane along <110> direction triples shear resistance
l Minimal aperture deformation at 1200°C
l Stainless Steel Wire
l Medical Wires: Tungsten/Molybdenum guidewires , NiTi alloy wires
l Luxury Jewelry: Mirror-finish gold/platinum wires
l Semiconductor: Bonding copper wires
l Industrial Mass Production: Enameled wires, welding wires
Production Specification Sheet-HPHT
PRODUCT | NOMINAL | THICKNESS | MINIMUM |
SCD111 07 | 0.7 | 0.66-0.75 | 0.8 |
SCD111 08 | 0.8 | 0.76-0.85 | 0.9 |
SCD111 09 | 0.9 | 0.86-0.95 | 1.0 |
SCD111 10 | 1.0 | 0.96-1.05 | 1.1 |
SCD111 11 | 1.1 | 1.06-1.15 | 1.2 |
SCD111 12 | 1.2 | 1.16-1.23 | 1.3 |
SCD111 13 | 1.3 | 1.26-1.35 | 1.4 |
SCD111 14 | 1.4 | 1.36-1.45 | 1.45 |
SCD111 15 | 1.5 | 1.46-1.55 | 1.5 |
Production Specification Sheet-CVD
Zero Repolishing: Bore finish meets direct production requirements
Thermo-Mechanical Synergy: reduction in wire oxidation
Modular Design: 5-minute die change cuts downtime
Product Picture
(111)-Oriented Diamond Wire Drawing Dies
CVD & HPHT Dual-Technology Solutions for Precision Wire Manufacturing
Core Technical Parameters
Parameter | CVD Diamond | HPHT Diamond |
Process | Chemical Vapor Deposition | High Pressure High Temperature |
Orientation | (111) | (111) |
Wire Diameter | φ0.003mm~φ5.0mm | φ0.003mm~φ2.0mm |
Competitive Advantages
CVD Diamond Highlights
l Ultimate Precision
l Thermal Mastery
HPHT Diamond Strengths
l Cost Efficiency
l Complex Profiles
Shared Benefits
l Monocrystalline structure eliminates grain-boundary failures
l (111) plane along <110> direction triples shear resistance
l Minimal aperture deformation at 1200°C
l Stainless Steel Wire
l Medical Wires: Tungsten/Molybdenum guidewires , NiTi alloy wires
l Luxury Jewelry: Mirror-finish gold/platinum wires
l Semiconductor: Bonding copper wires
l Industrial Mass Production: Enameled wires, welding wires
Production Specification Sheet-HPHT
PRODUCT | NOMINAL | THICKNESS | MINIMUM |
SCD111 07 | 0.7 | 0.66-0.75 | 0.8 |
SCD111 08 | 0.8 | 0.76-0.85 | 0.9 |
SCD111 09 | 0.9 | 0.86-0.95 | 1.0 |
SCD111 10 | 1.0 | 0.96-1.05 | 1.1 |
SCD111 11 | 1.1 | 1.06-1.15 | 1.2 |
SCD111 12 | 1.2 | 1.16-1.23 | 1.3 |
SCD111 13 | 1.3 | 1.26-1.35 | 1.4 |
SCD111 14 | 1.4 | 1.36-1.45 | 1.45 |
SCD111 15 | 1.5 | 1.46-1.55 | 1.5 |
Production Specification Sheet-CVD
Zero Repolishing: Bore finish meets direct production requirements
Thermo-Mechanical Synergy: reduction in wire oxidation
Modular Design: 5-minute die change cuts downtime
Product Picture